thermalshunt |
2-port MMIC die with variable base temperature (for interface matching), and a single averaged surface heating element |
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Author(s): Bill Batty, Carlos Christoffersen| Parameter | Type | Default value | Required? |
|---|---|---|---|
| ntimesteps: Number of time steps in transient simulation | INTEGER | 0 | no |
| dt: Length of timestep (s) | DOUBLE | 0 | no |
| tambient: Ambient temperature (K) | DOUBLE | 300 | no |
| time_d: Flag, if true, calculate in the time domain. | BOOLEAN | false | no |
| read_input: Flag, read_input thermal resistance matrices from file. | BOOLEAN | false | no |
| l: Substrate x-dimension in meters. | DOUBLE | 0.0004 | no |
| w: Substrate y-dimension in meters. | DOUBLE | 0.0004 | no |
| d: Substrate z-dimension in meters. | DOUBLE | 0.0004 | no |
| xl: x-coordinate of left edge of heating element. | DOUBLE | 0.00022 | no |
| xr: x-coordinate of right edge of heating element. | DOUBLE | 0.00018 | no |
| yu: y-coordinate of upper edge of heating element. | DOUBLE | 0.00022 | no |
| yd: y-coordinate of lower edge of heating element. | DOUBLE | 0.00018 | no |
| ks: Thermal conductivity of die material (W/m.K). | DOUBLE | 46 | no |
| rho: Density of die material (kg.m-3). | DOUBLE | 5320 | no |
| c: Specific heat of die material (J/kg.K). | DOUBLE | 350 | no |
| nfingers: Number of power transistor fingers | INTEGER | 1 | no |
| b: Exponent in power law temperature dependence of thermal conductivity | DOUBLE | 1.22 | no |
fREEDA Version 1.3 compiled on Jul 25 2007 12:04:09