mosnbsim4

MOSFET using BSIM4 model


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Author(s): Nikhil Kriplani

Usage:

Parameter TypeDefault value Required?
TOXE: Electrical gate equivalent oxide thickness DOUBLE 3e-09 no
TOXP: Physical gate equivalent oxide thickness DOUBLE 3e-09 no
EPSROX: Gate dielectric constant relative to vacuum DOUBLE 3.9 no
VFB: Flat-band voltage DOUBLE -1 no
VTH0: Long-channel threshold voltage DOUBLE 0.7 no
NGATE: Poly Si gate doping concentration DOUBLE 0 no
XL: Channel length offset due to mask/etch effect DOUBLE 0 no
XW: Channel width offset due to mask/etch effect DOUBLE 0 no
NF: Number of device fingers DOUBLE 1 no
W: Width of the device DOUBLE 5e-06 no
L: Length of the device DOUBLE 5e-06 no
DWG: Coefficient of gate bias dependence of Weff DOUBLE 0 no
DWB: Coefficient of body bias dependence of Weff DOUBLE 0 no
WINT: Channel-width offset parameter DOUBLE 0 no
WLN: Power of length dependence of width offset DOUBLE 1 no
WL: Coefficient of length dependence for width offset DOUBLE 0 no
WWN: Power of width dependence of width offset DOUBLE 1 no
WW: Coefficient of width dependence for width offset DOUBLE 0 no
WWL: Coefficient of length and width cross term dependence for width offset DOUBLE 0 no
LINT: Channel-length offset parameter DOUBLE 0 no
LLN: Power of length dependence for length offset DOUBLE 1 no
LL: Coefficient of length dependence for length offset DOUBLE 0 no
LW: Coefficient of width dependence for length offset DOUBLE 0 no
LWN: Power of width dependence for length offset DOUBLE 1 no
LWL: Coefficient of length and width cross term dependence for length offset DOUBLE 0 no
K1: First-order body bias coefficient DOUBLE 0.53 no
K2: Second-order body bias coefficient DOUBLE -0.0186 no
LPEB: Lateral non-uniform doping effect on K1 DOUBLE 0 no
LPE0: Lateral non-uniform doping parameter at Vbs=0 DOUBLE 1.74e-07 no
K3: Narrow width coefficient DOUBLE 80 no
K3B: Body effect coefficient of K3 DOUBLE 0 no
W0: Narrow width parameter DOUBLE 2.5e-06 no
DVT0W: First coefficient of narrow width effect on Vth for small channel length DOUBLE 0 no
DVT0: First coefficient of short-channel effect on Vth DOUBLE 2.2 no
DVT1W: Second coefficient of narrow width effect on Vth for small channel length DOUBLE 5.3e+06 no
DVT1: Second coefficient of short-channel effect on Vth DOUBLE 0.53 no
DSUB: DIBL coefficient exponent in sub-threshold region DOUBLE 0.56 no
ETA0: DIBL coefficient in sub-threshold region DOUBLE 0.08 no
ETAB: Body-bias coefficient for the sub-threshold region DOUBLE -0.07 no
TOXM: Tox at which parameters are extracted DOUBLE 3e-09 no
T: Temperature DOUBLE 300 no
NDEP: Channel doping concentration at depletion edge for zero body bias DOUBLE 1.7e+17 no
PHIN: Non-uniform vertical doping effect on surface potential DOUBLE 0 no
VBM: Maximum applied body bias in VTH0 calculation DOUBLE -3 no
NSUB: Substrate doping concentration DOUBLE 6e+16 no
DVT2W: Body-bias coefficient of narrow width effect for small channel length DOUBLE -0.032 no
NSD: Source/drain doping concentration fatal error if not positive DOUBLE 1e+20 no
DVT2: Body-bias coefficient of short-channel effect on Vth DOUBLE -0.032 no
MINV: Vgsteff fitting parameter for moderate inversion condition DOUBLE 0 no
NFACTOR: Subthreshold swing factor DOUBLE 1 no
CDSC: Coupling capacitance between source/drain and channel DOUBLE 0.00024 no
CDSCD: Drain-bias sensitivity of CDSC DOUBLE 0 no
CDSCB: Body-bias sensitivity of CDSC DOUBLE 0 no
CIT: Interface trap capacitance DOUBLE 0 no
KETA: Body-bias coefficient of bulk charge effect DOUBLE -0.047 no
B0: Bulk charge effect coefficient for channel width DOUBLE 0 no
B1: Bulk charge effect width offset DOUBLE 0 no
A0: Coefficient of channel-length dependence bulk charge effect DOUBLE 1 no
AGS: Coefficient of Vgs dependence of bulk charge effect DOUBLE 0 no
XJ: S/D junction depth DOUBLE 1.5e-07 no
U0: Low-field mobility DOUBLE 0.067 no
UA: Coefficient of first-order mobility degradation due to vertical field DOUBLE 1e-15 no
UB: Coefficient of second-order mobility degradation due to vertical field DOUBLE 1e-19 no
UC: Coefficient of mobility degradation due to body-bias effect DOUBLE -4.65e-11 no
EU: Exponent for mobility degradation DOUBLE 1.67 no
DELTA: Parameter for DC Vdseff DOUBLE 0.01 no
PDITS: Impact of drain-induced Vth shift on Rout DOUBLE 0 no
FPROUT: Effect of pocket implant on Rout degradation DOUBLE 0 no
PDITSL: Channel-length dependence of drain-induced Vth shift for Rout DOUBLE 0 no
PDITSD: Vds dependence of drain-induced Vth shift for Rout DOUBLE 0 no
PSCBE2: Second substrate current induced body-effect parameter DOUBLE 1e-05 no
PSCBE1: First substrate current induced body-effect parameter DOUBLE 4.24e+08 no
PDIBLCB: Body bias coefficient of DIBL effect on Rout DOUBLE 0 no
PVAG: Gate-bias dependence of Early voltage DOUBLE 0 no
PDIBL1: Parameter for DIBL effect on Rout DOUBLE 0 no
PDIBL2: Parameter for DIBL effect on Rout DOUBLE 0 no
DROUT: Channel-length dependence of DIBL effect on Rout DOUBLE 0.56 no
PCLM: Channel length modulation parameter DOUBLE 1.3 no
A1: First non-saturation effect parameter DOUBLE 0 no
A2: Second non-saturation factor DOUBLE 1 no
RDSWMIN: Lightly-doped drain resistance per unit width at high Vgs and zero Vbs DOUBLE 0 no
RDSW: Zero bias lightly-doped drain resistance per unit width DOUBLE 200 no
PRWG: Gate-bias dependence of LDD resistance DOUBLE 1 no
PRWB: Body-bias dependence of LDD resistance DOUBLE 0 no
WR: Channel-width dependence parameter of LDD resistance DOUBLE 1 no
WLC: Coefficient of length dependence for CV channel width offset DOUBLE 0 no
WWC: Coefficient of width dependence for CV channel width offset DOUBLE 0 no
WWLC: Coefficient of length and width crossterm dependence for CV channel width offset DOUBLE 0 no
DWJ: Offset of the S/D junction width DOUBLE 0 no
CLC: Constant term for the short channel model DOUBLE 1e-07 no
CLE: Exponential term for the short channel model DOUBLE 0.6 no
NOFF: CV parameter in VgsteffCV for weak to strong inversion DOUBLE 1 no
VOFFCV: CV parameter in VgsteffCV for weak to strong inversion DOUBLE 0 no
CF: Fringing field capacitance DOUBLE 1.08e-10 no
CKAPPAD: Coefficient of bias-dependent overlap capacitance for the drain side DOUBLE 0.6 no
CKAPPAS: Coefficient of bias-dependent overlap capacitance for the source side DOUBLE 0.6 no
LLC: Coefficient of length dependence on CV channel length offset DOUBLE 0 no
LWC: Coefficient of width dependence on CV channel length offset DOUBLE 0 no
LWLC: Coefficient of length and width cross term dependence on CV channel length offset DOUBLE 0 no
WWLC: Coefficient of length and width cross term dependence on CV channel width offset DOUBLE 0 no
VOFF: Offset voltage in the subthreshold region for large W and L DOUBLE -0.08 no
VOFFL: Channel length dependence of VOFF DOUBLE 0 no
POXEDGE: Factor for the gate oxide thickness in the S/D overlap regions DOUBLE 1 no
TOXREF: Nominal gate oxide thickness for gate dielectric tunneling current model DOUBLE 3e-09 no
NTOX: Exponent for the gate oxide ratio DOUBLE 1 no
DLCIG: Source/drain overlap length for Igs and Igd DOUBLE 0 no
AIGSD: parameter for Igs and Igd DOUBLE 0.43 no
BIGSD: parameter for Igs and Igd DOUBLE 0.054 no
CIGSD: parameter for Igs and Igd DOUBLE 0.075 no
MOIN: Coefficient for gate-bias dependent surface potential DOUBLE 15 no
VSAT: Saturation velocity DOUBLE 80000 no
PDITSD: Vds dependence of drain-induced Vth shift for Rout DOUBLE 0 no
AIGC: Parameter for Igcs and Igcd DOUBLE 0.43 no
BIGC: Parameter for Igcs and Igcd DOUBLE 0.054 no
CIGC: Parameter for Igcs and Igcd DOUBLE 0.075 no
NIGC: Parameter for Igcs, Igcd, Igs and Igd DOUBLE 1 no
PIGCD: Vds dependence of Igcs and Igcd DOUBLE 1 no
DVTP0: First coefficient of drain induced Vth shift due to long channel pocket devices DOUBLE 0 no
DVTP1: First coefficient of drain induced Vth shift due to long channel pocket devices DOUBLE 0 no
PRT: Temperature coefficient for RDSW DOUBLE 0 no
AT: Temperature cpefficient for saturation velocity DOUBLE 33000 no
XT: Doping Depth DOUBLE 1.55e-07 no
ALPHA0: First parameter of impact ionization current DOUBLE 0 no
ALPHA1: Isub parameter for length scaling DOUBLE 0 no
BETA0: Second parameter of impact ionization current DOUBLE 30 no
AGIDL: Pre-exponential coefficient for GIDL DOUBLE 0 no
BGIDL: Exponential coefficient for GIDL DOUBLE 2.3e+09 no
CGIDL: Parameter for body-bias effect on GIDL DOUBLE 0.5 no
EGIDL: Fitting parameter for band-bending for GIDL DOUBLE 0.8 no
ACDE: Exponential coefficient for charge thickness DOUBLE 1 no
DLC: Channel length offset parameter DOUBLE 0 no
DWC: Channel width offset parameter DOUBLE 0 no
AIGBACC: Parameter for Igb in accumulation DOUBLE 0.43 no
BIGBACC: Parameter for Igb in accumulation DOUBLE 0.054 no
CIGBACC: Parameter for Igb in accumulation DOUBLE 0.075 no
NIGBACC: Parameter for Igb in accumulation DOUBLE 1 no
AIGBINV: Parameter for Igb in inversion DOUBLE 0.35 no
BIGBINV: Parameter for Igb in inversion DOUBLE 0.03 no
CIGBINV: Parameter for Igb in inversion DOUBLE 0.006 no
EIGBINV: Parameter for Igb in inversion DOUBLE 1.1 no
NIGBINV: Parameter for Igb in inversion DOUBLE 3 no
KT1: Temperature coefficient for threshold voltage DOUBLE -0.11 no
KT1l: Channel Length dependence of KT1 DOUBLE 0 no
KT2: Body-bias coefficient of Vth with temperature effects DOUBLE 0.022 no

fREEDA Version 1.3 compiled on Jul 25 2007 12:04:09